Truth Instruments Co., Ltd.

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Wafer Level Hysteresis Loop Instrument Non Destructive Wafer Measurement System

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Truth Instruments Co., Ltd.
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Province/State:shandong
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Wafer Level Hysteresis Loop Instrument Non Destructive Wafer Measurement System

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Brand Name :Truth Instruments
Model Number :Wafer-MOKE
Place of Origin :CHINA
Price :Price Negotiable | Contact us for a detailed quote
Payment Terms :T/T
Name :Hysteresis Loop Instrument
Uptime :90%
Magnetic Field Uniformity :Better Than ±1%@Φ1 Mm
EFEM :Optional
Sample Size :Compatible With 12-inch And Below, Supports Fragment Testing
Magnetic Field Resolution :PID Closed-loop Feedback Regulation, 0.01 MT
Testing Functions :Non-destructive Hysteresis Loop Measurement Of Magnetic Stacks/devices, Automatic Extraction Of Hysteresis Loop Information (free Layer And Pinned Layer Hc, Hex, M (Kerr Angle Value)), And Rapid Mapping Of Wafer Magnetic Characteristic Distribution
Testing Efficiency :12 WPH@±1.3 T /9 Sites Measurement/200 Mm Wafer
Sample Repeatability :Better Than 10 μm
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Wafer-Level Hysteresis Loop Measurement Instrument
Product Introduction

Using polar/longitudinal magneto-optical Kerr effects (MOKE), this instrument rapidly and globally detects the magnetism of wafer films. Non-contact measurement avoids wafer damage and is suitable for post-patterning sample testing in spin chip production. It provides a vertical magnetic field of up to 2.5 T and an in-plane magnetic field of up to 1.4 T, with strong magnetic fields inducing free and reference layer flipping in vertically anisotropic magnetic access random memory (MRAM) film stacks. Ultra-high Kerr detection sensitivity allows single-time characterization of subtle magnetic changes in different film layers. Combining laserpoint-by-point probing with scanning imaging enables rapid creation of global wafer magnetic characteristic maps, aiding process optimization and yield control.

Equipment Performance
Equipment Performance Indicator Description
Sample Size Compatible with 12-inch and below, supports fragment testing
Magnetic Field Vertical ±2.4 T; In-plane ±1.3 T
Magnetic Field Resolution PID closed-loop feedback regulation, 0.01 mT
Magnetic Field Uniformity Better than ±1%@Φ1 mm
Kerr Angle Resolution 0.3 mdeg (RMS)
Testing Efficiency 12 WPH@±1.3 T /9 sites measurement/200 mm wafer
Sample Repeatability Better than 10 μm
Uptime 90%
EFEM Optional
Testing Functions Non-destructive hysteresis loop measurement of magnetic film stacks/devices, automatic extraction of hysteresis loop information (free layer and pinned layer Hc, Hex, M (Kerr angle value)), and rapid mapping of wafer magnetic characteristic distribution
Application Cases
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